Home Jammu Kashmir PM Modi lays foundation for India’s semiconductor future; country one step closer...

    PM Modi lays foundation for India’s semiconductor future; country one step closer to self-reliance

    Gujarat, Mar 13: Prime Minister Narendra Modi virtually turned the soil on three of India’s most ambitious semiconductor projects totalling over Rs 1.25 lakh crore yesterday. Addressing the nation from Gujarat, PM Modi described it as a “historic day” that will take the country towards an advanced, modern future through indigenous chip manufacturing.

    The groundbreaking ceremony kicked off India’s efforts to establish a vibrant semiconductor ecosystem and reduce its dependence on imports. Over Rs 1.25 lakh crore will be invested in setting up two cutting-edge fabrication plants, or “fabs”, as well as outsourced semiconductor assembly and test facilities in Gujarat and Assam. Experts say this will generate over 1 lakh job opportunities.

    Highlighting past failures of successive governments, PM Modi emphasised his administration’s commitment to realising India’s potential as a semiconductor powerhouse. While earlier regimes made empty promises and scams, his government is delivering results through concrete steps like these projects.

    Homegrown semiconductor chips will power a swadeshi revolution, strengthening India’s self-reliance. They will fuel sectors from electronics and automobiles to defence and railways with locally developed, cutting-edge components. This puts India on track for modernity and helps realise the dream of an Aatmanirbhar Bharat.